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Counterfeit Components
Avoidance Workshop

Tuesday 09:00 - 17:00

Details and Registration Form

Counterfeit electronic components entering the supply chain are causing a huge economic impact in the electronics industry. This Workshop discusses avoidance practices to combat this problem through case histories, contributing causes, procurement issues, inspection & testing techniques and the prevention actions that should be taken.

 This Workshop is a modified version of the highly successful workshops that were presented in Huntsville, Austin, NASA Houston, Los Angeles, Boston, San Diego & Orlando.

Workshop Topics

These topics will be presented by experienced component engineers well versed in the detection of counterfeit components:

  1. Introduction & Scope - Leon Hamiter, CTI, Inc
  2. Case Histories on Detection of Counterfeits - Tom Lee, Jabil
  3. Mitigation of Counterfeit Components in the Supply Chain- Ben Carter, General Dynamics
  4. Counterfeit Components - Imitation is the Greatest Form of Flattery - Lloyd Francis, Alter Technology
  5. Detection Methods and Tools for Counterfeit Components - Tom Lee, Jabil
  6. Data Sources to Detect Counterfeits - Leon Hamiter, CTI, Inc.
  7. Impact of RoHs Conversion on Reliability - Tom Lee
  8. Selecting a Suitable Analysis Lab - Leon Hamiter, CTI, Inc
  9. IC Counterfeit Detection - Hal Rotchadl, Premier Semiconductor Services
  10. A Supplier’s Program to Detect & Eliminate Counterfeit Components - Rob Cohen, Crestwood Tech.
  11. Counterfeit Avoidance Practices - Procurement, Inspection & Test - Leon Hamiter & Tom Lee

Attendees will receive a Certificate of Attendance


The workshop is designed for:

Original Equipment Manufacturers (OEMs)
Original Component Manufacturers (OCMs)
Contract Manufactures (CMs)
Independent Distributors (IDs)
Brokers

Goal

Provide awareness and training in the techniques and practices required to detect and avoid counterfeit components and the costs and risks associated with them.

 Factors contributing to counterfeit components!

 

For full details see the Conference Programme