22 June 09:00 - 17:00
Counterfeit electronic components entering the supply chain are causing a huge economic impact in the electronics industry. This Workshop discusses new & advanced avoidance practices to combat this problem with procurement changes, examples of counterfeit techniques, proven inspection & testing practices and prevention actions that should be taken.
These topics will be presented by experienced component engineers well versed in the detection of counterfeit components:
1. Introduction to issues; L. Hamiter
2. Training on microscopes & lenses
and their use; T. Lee
3. Component visual and dimensional inspection; L. Hamiter
4. Hermetic package de-capping techniques; T. Lee
5. Analyzing data
sheets, mil specs and sample inspections to detect counterfeits; L. Hamiter
6. Examples of current counterfeiter practices; TBD
7. X-Ray Inspection; T.
Lee
8. BGA De-capping results; T. Devaney, Hi-Rel Labs
9. De-capping PEMs
with chemical techniques; E. Jordan, Nisene
10. Die inspection criteria and
photography; T. Lee
11. Use of XRF to detect counterfeits & RoHS compliance;
W. Steib, Helmut Fischer 12. Comparative electronic testing with curve
tracer & ABI tester; T. Lee
13. Due diligence practices to detect
counterfeits, including AS5553 and CCAP-101; L. Hamiter
Original Equipment Manufacturers (OEMs)
Original Component Manufacturers (OCMs)
Contract Manufactures (CMs)
Independent Distributors (IDs)
Brokers
Provide awareness and training in the techniques and practices necessary to detect and avoid counterfeit components.